二手 SHINKAWA UTC-1000 #9274484 待售

Wire bonders Bonding method: Ultrasonic thermo compression Bonding speed: 67 ms / 2 mm wire (With loop control) Machine accuracy: ±2.5 µm (3σ) ±3.5 µm (3 σ) For multi-bond setting Pattern recognition unit: Detection method: Gray scale correlation Direction speed: 0.11s max / 2 Points alignment Detection area: Die side X: ±0.31 mm Y: ±0.21 mm Maximum detection speed: Lead side X: ±1.26 mm Y: ±0.86 mm Bonding area: X: ±28 mm Y: ±33 mm Wire diameter: Gold wire, Φ15~38 µm Double flange spool, 2" (8000) Bonding wires Maximum bonding wire length 8 mm Lead frame dimensions: Width: 20~80 mm Length: 95~262 mm Thickness: 0.07~0.3 mm Loader / Unloader: Magazine stacker type Center-parting type universal indexer Less gauge pressure Compressed air: 500 KPa(5 kgf/cm²) 60 I/mm Vacuum pressure: -74 KPa (-550 mm Hg) Power consumption: 1000 W Power supply: AC 100 V ±5%, 50/60 Hz.