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热门产品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
1096
热门产品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
175
热门产品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
153
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
717
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
620
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
551
热门产品
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
646
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