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81 结果
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(24)
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(1)
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(1)
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(5)
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(3)
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(7)
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热门产品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
1059
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热门产品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
148
热门产品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
128
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
690
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
588
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
531
热门产品
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
614
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