显示第
1-30
of
39
发现的结果
过滤器
全部清除
过滤器
39 结果
优质的
-
(1)
-
(3)
-
(3)
-
(7)
-
(7)
-
(1)
-
(15)
找不到你要找的?
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
287
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
207
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
219
热门产品
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
239
热门产品
SHINKAWA
UTC-1000
Wire bonders Bonding method: Ultrasonic thermo compression Bonding speed: 67 ms / 2 mm wire (With lo
313
找不到你要找的?