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39 结果
优质的
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(1)
-
(3)
-
(3)
-
(7)
-
(7)
-
(1)
-
(15)
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热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
309
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
230
热门产品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
239
热门产品
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
264
热门产品
SHINKAWA
UTC-1000
Wire bonders Bonding method: Ultrasonic thermo compression Bonding speed: 67 ms / 2 mm wire (With lo
347
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