二手 DATACON / BESI 2200 Evo Plus #293822140 待售

ID: 293822140
优质的: 2023-2024
Die bonders Dynamic XYZ Theta servo motors Machine capability: 7 μm @ 3s Besi in-house pattern, fiducial recognition system lighting systems with RGB CMOS: camera, optic, illumination Substrate handling with transporting system Bond force sensor Mini-BMC kit: 0.0045° PC Operating system: linux GUI 2023 vintage Qty / Part / Description Option: (1) / DC2801MM / 2200 evo plus MASTER MODULE (1) / DC000009 / Belt transport system C-type (1) / DC1278 / Input buffer (1) / DC1528 / Output buffer (1) / DC2008 / Wafer table without stretcher (1) / DC2308 / Wafer lift incl. wafer changer (1) / DC350015 / Standard FoV SC (4,5 x 4,5 mm) (1) / DC350017 / Standard FoV UC (4,5 x 4,5 mm) (1) / DC4118 / Upgrade to heated bond head (1) / DC4308 / Tool changer unit 7 slots (1) / DC4318 / Upgrade tool changer unit to 14 slots (1) / DC4008 / Flip chip station for C-type TS (1) / DC5008 / Single die ejection unit (1) / DC5108 / Upgrade to multi die ejection carousel (requires DC5008) (1) / DC600010 / MAIN - high performance p/t dispenser (PDS) (1) / DC6408 / Slide fluxer 50x50 (incl. 1 cavity plate) (1) / DC700010 / Safety labels in English (1) / DC7708 / Ionizer right (1) / DC7028 / Wafer ID-reader (1) / DC7918 / Connection kit (tubes, fittings, cables) (1) / DC800054 / Wafer mapping (file based) Accessories: (1) / DC0518 / P-part at MAIN axis (1) / DC0528 / Heated p-part at MAIN axis (4) / DC000013 / Customized substrate carrier (1) / DC250001 / 2" WP-Adapter (8"-FF108) - 12 up - side clamp (std WT) (1) / DC250003 / 2" GP-Adapter - (8"-FF108) - 12 up - (std WT) (1) / DC250007 / Wafer magazine - 8" (FF108) 25 slots (1) / DC250007 / Wafer magazine - 12" (FF123) 25 slots (5) / DC4808 / Standard tool holder (without shank and tip) (5) / DC4960 / Pick & place or epoxy stamping tools (off the shelf, no customizing) (1) / DC450002 / Customized tool tip (2) / DC550001 / Eject tool base D20 (2) / DC550001 / Eject tool base D30 (5) / DC5038 / Multi-pin kit for eject tools (1) / DC600008 / add. MAIN - high performance auger dispenser (1) / TOOLEVO / Standard tooling (1) / DC700007 / Calibration, Lubrication kit (1) / DC7938 / Bondforce sensor calibration kit (1) / DC7968 / Calibration tool kit for C-type TS Customized Features: (1) / CMF000663 / Static 3x WP/GP Holder in combination with Squeegee and 14up toolbench (1) / CMF000848 / Squeegee in combination with 14up Toolbench (1) / CMF000830 / Camera System for Process inspection.
DATACON/BESI 2200 Evo Plus是一款高度先进的模具附件设备,专为半导体制造中的精密装配过程而设计。这台尖端机器结合了最先进的技术和业界领先的功能,以确保模具粘合应用的最佳性能和可靠性。BESI 2200 Evo Plus采用模块化设计,允许灵活性和定制,以满足各种生产环境的特定要求。这种多功能性使系统能够适应广泛的应用,从标准模具粘合到复杂的封装解决方桉。DATACON 2200 Evo Plus的关键亮点之一是其高速、高精度的放置能力。该装置配有先进的视觉系统,能够精确定位和调整模具,确保最佳的粘结质量和可靠性。这种精确度在半导体制造过程中是必不可少的,即使是最小的错位也会导致严重的缺陷或性能问题。除了卓越的放置精度外,2200 Evo Plus还提供快速的吞吐量速率,以满足大批量生产环境的需求。该机器旨在最大限度地提高效率和生产率,使制造商能够在不影响质量的情况下实现快速循环时间和增加产量。此外,DATACON/BESI 2200 Evo Plus还配备了高级流程控制功能,可确保一致且可重复的结果。该工具结合了智能软件算法,实时监控和调整各种参数,以补偿装配过程中的任何变化或偏差。这种积极主动的方法有助于最大限度地减少废品率和优化产率,从而节省成本并提高总体效率。BESI 2200 Evo Plus的另一个关键优势是其用户友好的界面和直观的操作。该资产的设计考虑到了操作员,它具有触摸屏显示屏和易于使用的控件,简化了编程和设置任务。这种以用户为中心的设计有助于缩短操作员的学习曲线,并降低操作过程中出现错误或错误的风险。在可靠性和维护方面,DATACON 2200 Evo Plus的打造是为了抵御持续生产的严酷。该模型采用高质量的材料和组件来构建,以确保长期耐用性和性能一致性。此外,该机器的设计便于访问和维修,允许快速维护和故障排除,以最大程度地减少停机时间并最大限度地提高正常运行时间。总体而言,2200 Evo Plus代表了半导体制造中模具粘合应用的一流解决方桉。凭借其先进的技术、高速的能力、精确的放置、过程控制功能、用户友好的界面和可靠的可靠性,该设备为业界的效率和性能树立了新的标准。
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