二手 DATACON / BESI 2200 PPS #9169223 待售

Flip chip bonder, 8" Control system: VME Bus / CAN Bus Operator monitor / Operator interface: Flat screen monitor, 15" Operating system: Vx Works Chip thicknesses: 90-150µm thickness Data storage: Internal hard External 3.5" disk drive (Only HD disks with 1.44 MB) Material infeed: Chip sizes: 0.2-20 mm (manual adaptation of the ejection kit of the ejection system is necessary) Chip thicknesses: > 0.15 mm Frame sizes: Up to 254 mm (10") Substrate: Substrate size (transport system): Max 255 x 203 x 30 mm Component height (e.g. SMD’s): Max 30 mm with tool changer up to 10 mm Substrate transport height (SMEMA 1.2): 940 - 945 mm, resp. 37 - 38" Max number of bonding points / Single module: 100 per chip type Max number of single modules / Substrate: 100 with free programming 60,000 per matrix programming Max number of single substrates / Transport unit (carrier or boat): 300 Tool changer: Max number of tool holders: 6 Tool change time, approximately: 1.5 sec Ejection system changer: Max number of interchangeable tools: 5 Tool change time, approximately: Up to 4.0 s when changing from 1st to 4th tool Epoxy - Module: Working range (XYZ): 254 x 200 x 50 mm Dispenser: Feed method (standard): Dosing via feed spindle Feed method (optional): Pressure / time dosing Cartridge sizes: 5, 10 and 30 ccm (on the auxiliary Z axis only up to 10 ccm) Pick / Place Module: Working range (XYZ): 254 x 200 x 30 mm Working range with auxiliary Z axis: 200 x 200 x 30 mm 2001 vintage.