二手 AMAT / APPLIED MATERIALS eMax CT+ #293727706 待售
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ID: 293727706
晶圆大小: 12"
优质的: 2008
Etcher, 12"
Wafer cooling method: Wafer backside cooling by He gas
Wafer holding mechanism: Electrostatic adsorption (Ceramic ESC)
Chamber material: 6061-T6 Aluminium alloy
Chamber evacuation: Exhaust with a backing pump
Ultimate pressure: ≤ 1.3 x 10^-3 Pa
Chamber leak amount: ≤ 266 mPa/min
Pressure monitor: 1333 Pa
Pressure measurement range: 0 to atmospheric pressure
Pressure control: Throttle valve
Pressure interlock: half atom switch
Wall / Cathode temperature control: heat exchanger
Chamber wall circulating water flow sensor
Chamber cathode circulating water flow sensor
Process Kit: RAISED Si / Si
KALREZ 8575 Dry Clean Chamber vacuum seal
EDWARDS STP-A1603P 1600L/S 2 Turbo Pump
TOYOTA T100L Pump
EBARA ESR80WN Pump
MKS/ENI GHW12 RF Generator, 13.56 MHz, 1250 W
MKS/ENI B-5002-0SPECTRUM RF Generator, 2 MHz, 5000 W
ADVANCED ENERGY VHF2760 RF Generator, 60 MHz, 2700 W
Endpoint specification: Eye-D / 200-800nm
HV Power supply
Chamber liner: Yttrium liner
Gas panel specification:
AERA PI-980 MFC
Gas line connection: Single Line Drop (SLD) connection
SLD Specification:
TESCOM SLD Regulator
ENTEGRIS SLD Filter
CKD SLD Manual valve
Gas / Size
C4F6 / 100 SCCM
CH2F2 / 100 SCCM
CH3F / 100 SCCM
C4F8 / 100 SCCM
CF4 / 300 SCCM
CHF3 / 300 SCCM
O2 / 2000 SCCM
O2 / 200 SCCM
O2 / 20 SCCM
Ar / 200 SCCM
Ar / 2000 SCCM
N2 / 200 SCCM
(2) Load lock chambers:
Slow pump / fast pump switchable
Equipped with cool down function
Chamber material: 6061-T6 Aluminum alloy
Chamber pressure monitor: Convectron gauge
Chamber vacuum sealing method: Viton O-Ring
VAT Slit valve
Ultimate pressure: ≤ 13.3 Pa (100mTorr)
Chamber leak amount: ≤ 1.33 Pa (10mTorr/min)
Transfer chamber:
Chamber pressure control: Auto Pressure Control (APC)
Chamber material: 6061-T6 Aluminum alloy
Chamber pressure monitor: Convectron gauge
Chamber vacuum sealing method: Viton O-Ring
VAT Slit valve
Wafer transfer robot
Wafer blade: Dual blade
Chamber evacuation
Ultimate pressure: ≤ 13.3 Pa
Chamber leak amount: ≤ 1.33 Pa
Remote signal tower
Factory interface:
YASKAWA LM Track Atmospheric Transfer robot
No Right and left side storage pod
(3) Loadports
25-Wafers FOUP
No ionizer
E84 PIO Sensor
E99 Carrier ID
Wafer mapper
Power supply: 200/208 V, 60 Hz
2008 vintage.
AMAT/APPLIED MATERIALS eMax CT+蚀刻器/asher是一种高性能设备,为多层沉积过程提供高级蚀刻和蚀刻回功能。它是微电子和光子学行业广泛材料蚀刻和灰化的理想选择。它通过使用高级传感器、计算机辅助设计(CAD)和实时激光成像提供精确的过程控制。AMAT EMAX_CT+由设计用于大面积处理的七个工艺室组成。每个腔室都配有一个集成的光刻胶带状腔室,允许在一个会话中完成多个过程。晶圆通过自动卡式进纸装置送至APPLIED MATERIALS E-MAX CT+工艺室。然后将其降低到位,与腔室中央的基板对齐。然后将腔室加热并排出,以确保一致的灰化过程结果。根据用户的设计为每个基板和层图样定制处理程序。然后将晶片暴露于脉冲紫外线激光器中,该激光器可以蚀刻光致抗蚀剂图样,而无需额外的化学物质或气体。与传统的湿蚀刻方法相比,这种激光辅助蚀刻工艺减少了时间和成本。EMAX_CT+还具有可选的高效电子束灰化器,能够实现低总蚀刻停止层厚度和高蚀刻效率。电子束灰光机还利用先进的温度控制设备,确保在正确的温度下完成灰光化过程。AMAT/APPLIED MATERIALS EMAX_CT+还配备了先进的实时成像系统,用户可以在处理晶片时监视其晶片。该单元不仅提供了有关该过程进展的信息,而且还可用于检测蚀刻过程中可能发生的任何问题或不规则性,然后可以解决这些问题以改进结果。APPLICED MATERIALS eMax CT+蚀刻器/asher是一种先进的机器,它提供精确的过程控制和广泛的功能,以确保对复杂的基板和层进行高质量的蚀刻和粉刷。其先进的激光成像工具、温度控制、电子束灰烬,使其成为大型微电子和光子学应用的理想选择。
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