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AMAT / APPLIED MATERIALS
eMax CT+
Etcher, 12" Wafer cooling method: Wafer backside cooling by He gas Wafer holding mechanism: Electros
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Oxide etcher, 12" TM Module (3) PM Modules AC Rack RF Rack FI (EFEM): FI Type: 5.3 FI MF Platform t
352
热门产品
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Oxide etcher, 12" (3) Chambers (A, B, C) MF Platform type: AP FI (EFEM): SUPERMICRO GEN3 0090-06587
137
