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KOH-YOUNG KY 8030 #9411845

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Solder Paste Inspection (SPI) systems PCB Size: 250 x 330 Resolution: 20 µm.
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KOH-YOUNG KY 8030 #9354577

KOH-YOUNG

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3D In-Line Solder Paste Inspection (SPI) system 2012 vintage.
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KOH-YOUNG KY 8030 #9241616

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