二手 DMC SA/4m #143323 待售
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ID: 143323
晶圆大小: 8"
优质的: 2006
Wafer-level Electro Plating system, 8"
Used for Stamper and micro pattern electro-plating
Can be implement as high uniformity
Using cathode head rotating system can produce high-quality products
This equipment can be applied to MEMS type and performed on the trench fill electroplating
Process automation can be set with Independent program for each cell
Various plating condition can be set with Independent program for each cell
DC, pulse, pulse- reverse current can be supplied in the resolution ±1 mA
Ni, Ni-CO, Cu Electroplating can be performed with this equipment
Total solution volume: 500 liters
Features:
Small Footprint
Independent Pump/Filtration for each cell
Patented adjustable cathode head and workholder for precise control of thickness variation
Front access for maintenance
Integrated all-in-one design, integrated sump & electronics
Enclosed work area for process control
Industrial PC control with large flat panel touch-screen display
Switch mode rectifiers
Easy operator interface
All digital Control system
(Qty 3) Cells:
Pump: 1 HP
Heater: 6 kW
Rectifier: Standard 65 Amps, 24VDC
Filtration: 2 Stage
Pre-filter: 5 micron DOE, 20"
Final-filter: 0.45 micron DOE, 20"
Flow: 50 liter max (Adjustable)
2006 vintage.
DMC SA/4m是杜邦MicroCircuit Materials製造的光刻胶设备。该系统在有机基座上使用感光聚合物层,常用于生产电路板和其他电子应用中发现的铜和铝基板。DMC SA/4m光致抗蚀剂单元由覆盖在柔性聚酯基板上的有机膜组成。该基层为顶部的光敏聚合物层提供刚度和保护。聚合物层包括树脂,如聚酰亚胺、聚甲基丙烯酸酯、聚丙烯酸酯、聚碳酸酯和聚苯乙烯,所有这些都可以涂覆在各种厚度的基层上,以适应不同的底物构型。光致抗蚀剂被光激活,引起光化学反应,其中某些区域暴露,而其他区域受到保护。受保护区域保持其原始形式,而暴露区域则发生化学变化,根据聚合物层的组成而变得可溶性或不溶性。可溶性聚合物在冲洗过程中被蚀刻掉,然后剩下的不溶性区域被化学磨掉。此过程将删除不需要的材料,并为产品创建所需的形状。DMC SA/4m光致抗蚀剂机通常应用于湿式层压工艺中,采用均匀的薄膜厚度,然后进行彻底干燥和化学预处理。一旦涂上了薄膜,就可以在化学蚀刻之前用光源曝光并显影。开发过程结束后,可以执行质量控制,以确保实现所需的配置。这一过程涉及通过光学或X射线显微镜检查薄膜图样,以及二次测试来测量开发过程的准确性和完整性。总之,DMC SA/4m光刻工具是用于制造电路板和其他电子产品的先进资产。它能够准确地曝光和开发光刻胶薄膜,为制造优质产品提供了必要的设计精度。该模型由柔性基层、感光聚合物层和涉及各种预处理和工艺包括光照、显影和化学蚀刻的光刻工艺组成。质量控制过程用于验证图桉膜在整个过程中是否符合规格。
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