二手 EEJA / ELECTROPLATING ENGINEERS OF JAPAN Cup-Plater #9280818 待售

Electro Chemical Deposition (ECD) system Used for Cu & Ni plating Bench(Inner table): FM PVC material (Ivory) Attached drawings: Layout: K133-0001P-1 Process piping diagram: K133-0002M-1 Nitogen piping diagram: K133-0003M-1 Air piping diagram: K133-0004M-1 Vacuum piping diagram: K133-0005K-1 Plating cup: Cup: HT-PVC material Plating jigs: Anode: Pt/Ti Cathode: Ring type Top plate: HT-PVC Top ring: HT-PVC Bridge disk: HT-PVC Seal packing: Silicon Top ring packing: Silicon Diffuser: HT-PVC Wafer press cup: Acrylic Cylinder for pressure Vacuum tweezers: Teflon(NC) Reservoir tank: Tank: HT-PVC Capacity: 40 L Level sensors: 2 points: low level ,empty level Circulation pump: MD-100FY-3, 3 Phase, 200 V Filter:10" length Flow meter: 4-40L/min Heater / Heater fuse: Teflon heater 2KW Valve: Clean: HT-PVC Piping: Clean: HT-PVC Thermo sensor: Pt100 OHM Di. Water rinse tank: Tank: PVC Capacity: 20L Drain valve: Clean: PVC Piping: Clean: PVC Drag-out tank: Tank: PVC Capacity: 20L Overflow: Not equipped Drain valve: Clean: PVC Piping: Clean: PVC Process controller PLC: Control range: plating control, interlock, alarm Rectifier: Capacity: 0-20 V, 4 A, constant current / constant voltage Waveform: Direct Current Touch panel: Recipe choice Recipe edit Parameter set Start Manual pump operation Alarm Auto/Manual choice Signal tower(3 color): Plating: Green signal Stand-by: Yellow signal Alarm: Red signal Others: Hand shower: Front side (2) Fluorescent light: 20W Nitrogen gun : Front side Vacuum tweezer- Front side Nitrogen piping unit Air piping unit Vacuum piping unit.