二手 FSI / TEL / TOKYO ELECTRON Mercury MP #9161972 待售

看起来这件物品已经卖了。检查下面的类似产品或与我们联系,我们经验丰富的团队将为您找到它。

ID: 9161972
优质的: 1996
Spray processor, 8" Software: 11 FSI Standard exhaust config: Yes Dual exhaust: No Turntable style (PFA vs. Ti vs. SS): PFA 918600-003 Motor and motor speed controller: Upgrade 232608-003 Booster pump: Yes, not dual Helios: Yes Ti T/C's: No Canister remote length: 25' Vertical lift kit length: 20' Vertical lift kit: Some canisters Center SP etch probe: No SBSP: Yes SBSP Etch probe: Yes I/R Htr(P)ost Man / (C)hem spec: No I/R Heater split manifold: No I/R Heater bypass valves: No CPU 286: No CPU 486 25 mH: No CPU 486 80 mH: No CPU 586 Yes: 922081-001 HF Last: Yes LPP w / Flowmeter: Yes HF Last rinse bypass: Yes DI MIX: Yes H2SO4(Analog vs. NT): Yes H2O2 (Analog vs. NT): NT 30-300, 915191-102 HF400: Yes HF402 (Analog vs. NT): NT 15-150, 915191-101 HCL (Analog vs. NT): NT 15-150, 915191-101 NH4OH (Analog vs. NT): NT 15-150, 915191-101 Can position 1: Sulphuric (H2SO4) Can position 2: Hydrofluoric (10:1) Can position 3: Hydrofluoric (10:1) Can position 4: Ammonium hydroxide (NH4OH) Can position 5: Hydrochloric (HCl) Can position 6: Hydrogen peroxide (H2O2) HF / DI On-line blending: Yes Manifold type: PFA DI Flow switch / monitor: No N2 Flow monitor: No Recirculation: No Chemical heater (Stand alone): No N2 Heater: No UPS: No Component rinse: No SECS Comm: Yes Rear access: Yes Chemical sampling: No Photohelic monitor: Yes MHS: No Dual canister rotary board: No Autofill: HF- SULFURIC Remote touchscreen: No Dual touchscreen: No Direct feed: No Process application #1: RCA Clean Process application #2: B Clean Process application #3: SPM Only Process application #4: HF Last Pressure / Flow settings Bowl exhaust - IWC: 0.8 +/- 0.2 Bowl exhaust - FPM: N/A 1996 vintage.
FSI MERCURY MP是一款由FSI International, Inc开发的光刻胶设备。它用于半导体蚀刻过程中,半导体晶片暴露在紫外线下,改变了暴露材料的性质,更容易蚀刻掉。MERCURY MP系统使用真空光敏装置,允许对基板进行精确蚀刻。该机旨在为半导体晶片的细线蚀刻提供高性能、可靠的环境。真空光致抗蚀剂工具使用光投射资产和辐射室均匀暴露于紫外线。在辐照室中,高能紫外线投射到晶片上,使光敏材料暴露于光。曝光控制蚀刻深度,并消除了材料的底切或过度蚀刻的机会。该模型具有多种特点,有助于确保精确的控制和准确性。该设备使用精确的成像光学器件和坚固、高速的红外激光将光引导到晶圆上,允许非常精细的线路分辨率。该系统还利用精确的掩蔽和成像系统,结合高效的高性能光学投影单元(OPSM)进行均匀曝光。激光还能够快速调节其输出辐射,从而对曝光时间进行精确控制。FSI MERCURY MP机适合于广泛的光刻工艺,如深蚀刻和超细图桉。它还有一个先进的、可编程的用户界面,可以让用户快速、轻松地设置参数,实时查看蚀刻过程。MERCURY MP工具是一种功能强大、精密的光刻资产,适用于半导体行业的精密蚀刻。它是生产高密度集成电路以及其他微电子器件的理想选择。该模型提供了可靠和高性能的环境,具有精确的成像光学器件和坚固的高速激光器,以及可编程的用户界面,从而能够快速轻松地设置参数。
还没有评论