二手 SVG 86-3 #117950 待售
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ID: 117950
晶圆大小: 3"
single cabinet developer system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, HMDS vapor prime, chill, coat, bake, chill, receive
Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
O-ring belt transfer
Polyurethane
Silicone
Viton
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windowsxp application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 96 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 86-3是光刻的一个过程,使用光敏材料将图样从光掩模转移到基板上。它是一种具有紫外线成像工艺的正型、无挥发性液体光致抗蚀剂设备。86-3光抗蚀剂由聚合物粘合剂系统和感光成分组成。感光元件包含感光剂、灭火器、酸发生器和溶剂。聚合物粘合剂单元含有聚乙烯醇、苯乙烯、丁二烯、丙烯酸等聚合物。用紫外线照射SVG 86-3光致抗蚀剂的成像过程被激活。这一过程是由感光元件和聚合物粘合剂机之间的反应驱动的。紫外线电磁辐射会激活灭火器,并防止敏化剂将能量从光传递到粘合剂工具。这被称为"熄火"。酸发生器还与紫外线反应,转化为酸,产生催化反应,导致粘合剂资产进一步降解。当光致抗蚀剂被照射时,粘合剂模型变得不溶解,并且可以被显影溶液去除。然后,不溶性材料作为一个耐蚀刻屏障和保护底层防止蚀刻。另一方面,未辐照区域保留初始溶解度;它们被开发的解决方桉移除,留下一个裸露的底层图桉层。86-3光致抗蚀剂与包括金属和半导体表面在内的广泛基板兼容。它也适用于典型的金属蚀刻溶液和用于干蚀刻工艺的溶液。再者,这种光致抗蚀剂可以与湿蚀、等离子体蚀刻、氧等离子体灰化等多种蚀刻工艺结合使用。此外,SVG 86-3是一种低温、耐溶剂的设备。低温固化工艺有助于降低成本和植物负荷,而溶剂电阻可防止抗蚀剂和基材之间的交叉污染。抗蚀剂可以用常规的抗蚀剂剥离器和溶液去除。抗蚀剂系统还提供了对各种基材的出色附着力,包括金、铝、不锈钢和硅片。86-3单元是一种经济、高效、可靠的光刻技术,适用于多种应用。它具有高分辨率,适用于各种基材和蚀刻工艺。它也是一种低温、耐溶剂的机器,确保底物在整个光刻过程中保持其完整性。SVG 86-3光致抗蚀剂是图桉化层的绝佳选择,为制造复杂零件和设计提供了可靠、低成本的生产工艺。
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