二手 SVG 86-3 #117950 待售

SVG 86-3
製造商
SVG
模型
86-3
ID: 117950
晶圆大小: 3"
single cabinet developer system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, HMDS vapor prime, chill, coat, bake, chill, receive Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: O-ring belt transfer Polyurethane Silicone Viton Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windowsxp application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 96 x 40 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.
SVG 86-3是光刻的一个过程,使用光敏材料将图样从光掩模转移到基板上。它是一种具有紫外线成像工艺的正型、无挥发性液体光致抗蚀剂设备。86-3光抗蚀剂由聚合物粘合剂系统和感光成分组成。感光元件包含感光剂、灭火器、酸发生器和溶剂。聚合物粘合剂单元含有聚乙烯醇、苯乙烯、丁二烯、丙烯酸等聚合物。用紫外线照射SVG 86-3光致抗蚀剂的成像过程被激活。这一过程是由感光元件和聚合物粘合剂机之间的反应驱动的。紫外线电磁辐射会激活灭火器,并防止敏化剂将能量从光传递到粘合剂工具。这被称为"熄火"。酸发生器还与紫外线反应,转化为酸,产生催化反应,导致粘合剂资产进一步降解。当光致抗蚀剂被照射时,粘合剂模型变得不溶解,并且可以被显影溶液去除。然后,不溶性材料作为一个耐蚀刻屏障和保护底层防止蚀刻。另一方面,未辐照区域保留初始溶解度;它们被开发的解决方桉移除,留下一个裸露的底层图桉层。86-3光致抗蚀剂与包括金属和半导体表面在内的广泛基板兼容。它也适用于典型的金属蚀刻溶液和用于干蚀刻工艺的溶液。再者,这种光致抗蚀剂可以与湿蚀、等离子体蚀刻、氧等离子体灰化等多种蚀刻工艺结合使用。此外,SVG 86-3是一种低温、耐溶剂的设备。低温固化工艺有助于降低成本和植物负荷,而溶剂电阻可防止抗蚀剂和基材之间的交叉污染。抗蚀剂可以用常规的抗蚀剂剥离器和溶液去除。抗蚀剂系统还提供了对各种基材的出色附着力,包括金、铝、不锈钢和硅片。86-3单元是一种经济、高效、可靠的光刻技术,适用于多种应用。它具有高分辨率,适用于各种基材和蚀刻工艺。它也是一种低温、耐溶剂的机器,确保底物在整个光刻过程中保持其完整性。SVG 86-3光致抗蚀剂是图桉化层的绝佳选择,为制造复杂零件和设计提供了可靠、低成本的生产工艺。
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