二手 SVG 88-3 #117937 待售
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ID: 117937
晶圆大小: 3"
single cabinet 2-track vapor prime / coat / bake system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive
Track 2: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
Polyurethane
Silicone
Viton
Automated transfer arm
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windowsxp application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 108 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 88-3是一种领先的可水显影光刻设备,为最先进的半导体器件的光刻提供了极致的性能和分辨率。该系统由一个创新的双层树脂基薄膜组成,包含一个水性可显影底层,以及一个水性可显影底层。底层以经过高度改性的聚乙烯酚基聚合物为基础,旨在提供优异的水溶性、良好的湿蚀和干蚀性、优异的耐化学性以及优异的光学和电子束光刻分辨率。顶层以高密度聚乙烯溷合物为基础,可实现高对比度、清洁分辨率和快速水的开发。当用作负性光致抗蚀剂时,88-3单元不需要预处理,也不需要烘烤后步骤,增强了工艺灵活性。高对比度光和电子束光刻性能使其成为X射线源电路生成的一个有吸引力的选择。SVG 88-3出色的线缘粗糙度导致非常高的图像保真度和最小化的航空图像伪影。顶层经过优化,可用于248-nm和248/365-nm溷合光刻。与248/365-nm功率相比,它具有更好的线宽偏移和对比度。底层提供高分辨率能力和优异的水溶性,对于现代半导体器件光刻中的应用至关重要。双层组合改善了对比度,提供了极好的耐蚀刻性能,与水性可显影的光刻胶兼容,并提供低背景。与其他领先的光刻胶相比,88-3的水相近红外图像具有良好的对比度。这种能力使得它非常适合于亚波长成像,以及在几次迭加曝光下执行的成像应用。SVG 88-3的负音在与高级光源配合使用时也提供高对比度,使其非常适合与高NA步进器和扫描工具配合使用。88-3机用作正光抗蚀剂时,具有优异的成像性能和高分辨率。高对比度和出色的蚀刻电阻使得小特征器件的可靠制造和避免边缘显微镜。总体而言,SVG 88-3提供卓越的分辨率、蚀刻电阻、光学分辨率和高对比度成像,同时仍提供显着的工艺简化。其独特的双层组合使得它成为现代半导体器件制造的特别有吸引力的选择。这种光刻工具是设计师的理想选择,谁想要的最大性能和分辨率为他们的产品。
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