二手 SVG 88-3 #117937 待售

SVG 88-3
製造商
SVG
模型
88-3
ID: 117937
晶圆大小: 3"
single cabinet 2-track vapor prime / coat / bake system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive Track 2: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: Polyurethane Silicone Viton Automated transfer arm Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windowsxp application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 108 x 40 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.
SVG 88-3是一种领先的可水显影光刻设备,为最先进的半导体器件的光刻提供了极致的性能和分辨率。该系统由一个创新的双层树脂基薄膜组成,包含一个水性可显影底层,以及一个水性可显影底层。底层以经过高度改性的聚乙烯酚基聚合物为基础,旨在提供优异的水溶性、良好的湿蚀和干蚀性、优异的耐化学性以及优异的光学和电子束光刻分辨率。顶层以高密度聚乙烯溷合物为基础,可实现高对比度、清洁分辨率和快速水的开发。当用作负性光致抗蚀剂时,88-3单元不需要预处理,也不需要烘烤后步骤,增强了工艺灵活性。高对比度光和电子束光刻性能使其成为X射线源电路生成的一个有吸引力的选择。SVG 88-3出色的线缘粗糙度导致非常高的图像保真度和最小化的航空图像伪影。顶层经过优化,可用于248-nm和248/365-nm溷合光刻。与248/365-nm功率相比,它具有更好的线宽偏移和对比度。底层提供高分辨率能力和优异的水溶性,对于现代半导体器件光刻中的应用至关重要。双层组合改善了对比度,提供了极好的耐蚀刻性能,与水性可显影的光刻胶兼容,并提供低背景。与其他领先的光刻胶相比,88-3的水相近红外图像具有良好的对比度。这种能力使得它非常适合于亚波长成像,以及在几次迭加曝光下执行的成像应用。SVG 88-3的负音在与高级光源配合使用时也提供高对比度,使其非常适合与高NA步进器和扫描工具配合使用。88-3机用作正光抗蚀剂时,具有优异的成像性能和高分辨率。高对比度和出色的蚀刻电阻使得小特征器件的可靠制造和避免边缘显微镜。总体而言,SVG 88-3提供卓越的分辨率、蚀刻电阻、光学分辨率和高对比度成像,同时仍提供显着的工艺简化。其独特的双层组合使得它成为现代半导体器件制造的特别有吸引力的选择。这种光刻工具是设计师的理想选择,谁想要的最大性能和分辨率为他们的产品。
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