二手 AMAT / APPLIED MATERIALS P5000 #9133091 待售
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ID: 9133091
Metal etch, 8"
System Features:
1. Top-Mounted electronics: NO
2. Meets CE Mark Requirements: NO
3. System monitors: YES
4. Robot Handler Rev: Phase III(Overhaul Complete)
5. Cassette Handler Rev: Phase III
6. Factor Automation: NO
7. Storage Elevator Position Sensor: NO
8. Storage Elevator Wafer Orienter: NO
9. Elevator Brakes: YES
10. Storage Elevator Slots: 8
11. Load Lock Purge: NO
12. Load Lock Chamber Bolt Down Lid: YES
13. Load Lock Lid Lift: NO
14. Wafer Position Sensor: YES
15. I/O Wafer Sensor: YES
16. Slow Pump Hardware Installed: NO
17. Foreline Fittings for TC and N2 Purge: VCR Type
18. Load Lock Pump Type: NO Pump
19. Load Lock Pump Brand: N/A
Mainframe
1. Load Lock Degasser: N/A
2. Wafer Orienter Chamber: N/A
3. Endpoint System: Extrenal Emmision
4. Neslab Water Plumbing on Facilities Panel: YES
5. Heat Exchanger Plumbing on Facilities Panel: YES
6. Endpoint System: NONE
7. Robot Type: Phase III
8. Robot Condition: Good condition
9. Lower Circuit Breaker Panel: Present
10. Buuffer Chamber Condition: Good condition
Electronics:
1. Boss PROM: Unable to check. System not powered up.
2. Single Board Computer Type: Synergy
3. Software Revision: Unable to verify, System not powered up.
4. Minicontroller: Present
5. Light Pens: NONE
6. Chamber Interconnect PCB: Present
7. Mini SBC PCB: Present
8. System Electronics Interface PCB: Present
9. Video PCB: Present
10. Analog Output PCB: Present
11. Analog Input PCB: Present
12. Stepper PCB's: Present
13. Digiral I/O PCB's: Present
14. TC Gauge PCB: Present
15. Chopper Drivers: One card none
16. DC Power Cards: +12v card none
17. Buffer I/O PCB: Present
18. AI / MUX PCB: Present
19. Magnet Drivers: 2 Drivers present for Etch Chambers
Chamber Information:
1. Chamber A: Metal Etch MxP+
2. Chamber B: Metal Etch MxP+
3. Chamber C: ASP(strip)
4. Wafer Size: 200mm
5. Foreline Hardware: All Present
6. Capacitance manometers: Present
7. Wafer Lift Hardware: Present, needs servicing and clean-up.
8. Roughing Valves: Present, will need PM serviced and cleaned.
9. Throttle Valve Assemblies: All chambers present. Will need PM Seriviced.
10. RF Matches: Type 4 Matches. Etch Chambers present.
Gas Box Information:
1. MFC Type: No MFC's in Gas Box at time of audit.
2. BCL3 MFC's:
3. CL2 MFC's:
4. CF4 MFC's:
5. N2 MFC's:
Remote Information:
1. Heat Exchanger: AMAT 1X 1
2. Chiller: HX-150
3. RF Generators:OEM-12A & AX-2115
4. Remote Frame: Stand Alone-Delta
1996 vintage.
AMAT/APPLIED MATERIALS P5000是一种180毫米干蚀刻反应器，设计用于高性能蚀刻工艺。该设备能够为各种材料提供高度精确的蚀刻深度、高均匀性和出色的蚀刻选择性。AMAT P-5000配备了先进的硬件和软件,以确保在平面和3D结构方面均取得优异的效果。硬件包括射频发生器和射频匹配单元，以最大限度地提高蚀刻均匀性和效率。该系统还包括反应性气体输送单元、确定性运动控制和闭环射频输送机。此外,APPLIED MATERIALS P 5000还具有高级控制软件,如EtchVision,它是一种控制图形用户界面（GUI）,可轻松控制和定制蚀刻配方。此外，P-5000还建立了一个介电蚀刻室，以尽量减少等离子体室内的射频反射，减少敏感区域射频伪影的可能性。APPLICED MATERIALS P5000的设计是蚀刻最困难的材料，例如铵、钨和上午。它还能够在多层电介质中蚀刻而不会过度蚀刻。AMAT P5000还具有极好的氧化物蚀刻特性,具有最小的加热、冷却和不受控制的离子影响.该工具可用于深层蚀刻，适用于基板清洁和表面清洁步骤。AMAT P 5000是一个强大的蚀刻工具，可以为各种材料提供统一、精确、高性能的结果。它结合了高级硬件和软件,使用户能够以最小的努力实现他们所期望的流程目标。该资产非常适合在微电子、半导体和光电工业中应用，用于蚀刻敏感和具有挑战性的结构。
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