二手 AMAT / APPLIED MATERIALS P5000 #9164732 待售
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ID: 9164732
晶圆大小: 6"
优质的: 1992
Etcher, 6"
Mainframe configuration:
Mainframe type: Mark II
I/O Wafer sensor: Yes
Software revision level: TBD
Expaneded VME: Yes
Mini-controller: Yes
Phase 3 Robot: Yes
Phase 3 cassette handler: Yes
Storage elevator
(8) Slots
Cassette platform: Standard
Wafer orienter: No
L/L Chamber bolt down lid: No
L/L Particle reduction kit: No
Gas Panel:
MFC manufacturer / model: UFC-1100A
Gas panel type:
Twelve lines main: No
Twenty-eight line onboard: No
Standard gas panel (28 Line capability): Yes
Remote gas panel: No
Chamber A MFC Size Gas Cal Gas
Gas 1 slm O2 N2
Gas 2 slm O3 He
Gas 3 slm C2F6 N2
Gas 3 slm NF3 N2
Gas 200 sccm N2 N2
Gas
Gas
Gas
Chamber B MFC Size Gas Cal gas
Gas 1 slm O2 N2
Gas 2 slm O3 He
Gas 3 slm C2F6 N2
Gas 3 slm NF3 N2
Gas 200 sccm N2 N2
Gas
Gas
Gas
Chamber C MFC Size Gas Cal gas
Gas 300 sccm CF4 N2
Gas 100 sccm Ar N2
Gas 100 sccm O2$ O2
Gas 50 sccm O2 N2
Gas
Gas
Gas
Chamber D MFC Size Gas Cal gas
Gas 300 sccm CF4 N2
Gas 100 sccm Ar N2
Gas 100 sccm O2$ O2
Gas 50 sccm O2 N2
Gas
Gas
Gas
Hot box configuration:
Hot box configuration: Phase IV
Ampoule 1: Yes
Ampoule 2: No
Ampoule 3: No
Ampoule 4: No
Ampoule 5: No
Ampoule 6: No
Ampoule 7: Yes
Process kit configuration:
Process application:
Chamber A: CVD TEOS
Chamber B: CVD TEOS
Chamber C: Etch MxP
Chamber D: Etch MxP
System electronics:
Slot # Description
1 MINI SBC: Yes
2 SBC: Yes
3 SEI: Yes
4 MIZER: No
5 AI: Yes
6 AO: Yes
7 VIDEO: Yes
8 AO: Yes
9 AI: Yes
10 STEPPER: Yes
11 STEPPER: Yes
12 STEPPER: Yes
13 STEPPER: Yes
14 DI/DO: Yes
15 DI/DO: Yes
16 DI/DO: Yes
17 DI/DO: Yes
18 DI/DO: No
19 DI/DO: No
20 DIO: No
Floppy drive: 5 ¼
Chamber position dependent configurations:
Chamber A:
Chamber type: CVD
Lid: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD Fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: No
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: No
Lamp driver: Yes
RF Match: Yes
Turbo controller: No
Turbo flow meter: No
Gate valve: No
Chuck type: Other susceptor
Chamber B:
Chamber type: CVD
Lid type: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: No
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: No
Lamp driver: Yes
RF match: Yes
Turbo controller: No
Turbo flow meter: No
Gate valve: No
Chamber vent valve: Yes
Chuck type: Other susceptor
Chamber C:
Chamber type: MxP
Lid type: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: Yes
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: No
Lamp driver: Yes
RF match: Yes
Turbo controller: Yes
Turbo flow meter: No
Turbo pump / controller type: Leybold
Gate valve: No
Chamber vent valve: Yes
Chamber D:
Chamber type: MxP
Lid type: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: Yes
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: Yes
Lamp driver: No
RF match: Yes
Turbo controller: Yes
Turbo flow meter: No
Turbo pump / controller type: Leybold
Gate valve: No
Chamber vent valve: Yes
Remote frame:
Primary pump frame: No
Secondary pump frame: No
Stacked remote frame: yes
Stacked remote frame contents:
Heat exchanger
Ozone generator
(4) RF generators
Number of heat exchanger: 1
Water hoses: No
Hose fittings: QDC
Backing Pumps:
LL Chamber: No
Chamber A: No
Chamber B: No
Chamber C: No
Chamber D: No
RF Generators:
Chamber A: ENI 12A
Chamber B: ENI 12A
Chamber C: ENI 12A
Chamber D: ENI 12A
1992 vintage.
AMAT/APPLIED MATERIALS P5000气相沉积反应器是一种尖端工具,可实现复杂、可重现、高效和经济高效的薄膜沉积。AMAT P-5000具有庞大、集成和自动化的处理空间,可提供更大的周转时间和更多的基板传输选项。APPLICED MATERIALS P 5000还利用AMAT行业领先的Aur等离子体源提供了改进的工艺能力、更高的吞吐量和更好地满足不断变化的行业需求。P-5000的设计目的是减少工艺时间和提高吞吐量,同时在广泛的工艺流程中提供最佳的薄膜沉积。该系统采用CIVAX过程控制器,从一个紧凑、用户直观的平台为用户提供对整个沉积过程的控制。它可用于设置、监视和调整最多四个腔室的参数,以及存储供以后访问的配方。AMAT P5000还包括Auralens增强型沉积头,为一系列薄膜提供有利的均匀沉积和保形覆盖。AMAT P 5000创造了高精度的薄膜,具有极好的均匀性。它为所有薄膜应用提供了可重现、可靠的性能,最终满足了高性能薄膜的要求。该系统扩大基板尺寸范围,可以容纳矩形和圆形基板,从小晶片到8英寸和100毫米光盘。APPLIED MATERIALS P-5000具有扩展的源灵活性,允许用户自定义沉积过程。应用材料气相沉积源使薄膜能够利用无机薄膜和稀有化学前体化合物进行化学气相沉积(CVD)。该系统还提供了AMAT/APPLIED MATERIALS PlanarMax等离子体源,这是一种平面等离子体源,旨在最大程度地减少相邻井上的不良沉积。AMAT/APPLICED MATERIALS P 5000气相沉积反应器是一种自动化工具,它提供了改进的工艺能力、更高的吞吐量和更好的满足不断变化的行业需求,同时还在广泛的工艺过程中提供了最佳的薄膜沉积。它具有扩展的源灵活性和增加的基板尺寸功能,允许用户在所有薄膜应用中实现具有出色均匀性、可重现和可靠性能的高精度薄膜。
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