二手 ULTRATECH Saturn Spectrum 300 #9198660 待售
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已售出
ID: 9198660
优质的: 2005
Stepper
Mainframe configurations:
Controller unit:
Centralized control and distributed control
SECS Compatibility
Exposure unit:
Hg Lamp
GHI-Line light source
Indexer unit:
Two cassette loader / Unloader
Universal wafer size
Transfer unit:
Robot
Can handle 6", 8" and 12" wafers, both notch and flat type
Wafer stage unit:
Linear motor XY stage
Reticle stage
Automated wafer thickness compensator
Alignment unit:
Pre-alignment: Automatic enhanced global alignment
Through the lens alignment
MVS (Machine vision system) pattern recognition system
Closed loop dose control system
Focus detector and focus leveling system
Operation unit:
Alignment monitor
Program execution monitor
Keyboard or joy-stick
Printer
Safety unit:
Vibration isolation system
Auto alarm system
Interlock protection system
Hardware specification:
Notch and flat wafer
SEMI and JEIDA standard
Wafer thickness: 11-30 mil
Stage type:
Linear motor drive
3-Axes of freedom
Wafer handling:
Cassette to cassette
Conform to SEMI and JEDIA standard
Hg Lamp type: 1000 Watt
Reticle size: 6 x 6 x 0.25 inch
Reticle library: (12) Slots library with barcode reader
Fields per reticle:
1-4
6 x 6" -2- field, max field size: 44.0 x 26 mm
6 x 6" -3- field, max field size: 37.6 x 26 mm
6 x 6" -4- field, max field size: 27.6 x 26 mm
Maximum field size: 44 x 22 mm
Global alignment: Within ± 40 µm placement accuracy
Enhanced global alignment: 500 nm, 3δ (Reticle image recognition alignment system)
Alignment optical system: Bright field alignment
Up-time: ≥90%
MTTR: <4 Hours
Reliability test: Cycling test: > 500 wafers (with alignment) processed without reject and fail
Wafer breakage: ≤ 1/ 10000
Vibration control: Active air isolation
Computer / Printer type:
VME Bus controller
CPU: ≥35 MHz
Color graphic monitor
Enclosed impact printer
Process specification:
Minimum feature size: ≤1.40µm
DOF (Depth of focus):
≥ 4 µm (at 2 µm L/S with 2 µm thickness of resist)
≥ 8 µm (at 30/10 µm L/S with 23 µm thickness of resist)
≥10 µm (at 50 µm L/S with 120 µm thickness of drvr film)
Dynamic focus: Provides capability of exposing photosensitive films from 1- 125µm
CD Uniformity: ≤±10%
Irradiance at wafer plane: ≥1200mW/Cm²
Maximum image area: 44 X 26 mm²
Exposure spectrum: 350 - 450nm (GHI-line/ Full spectrum)
Exposure uniformity: ≤ ±4%
Alignment accuracy: ≤ 0.5 µm (3δ)
Throughput: 8-inch wafer, 400mj/ Cm², 44 x 22 mm field size, wafer layout 26 steps: >60 wph
Exposure linearity:≤ ±1%
2005 vintage.
ULTRATECH Saturn Spectrum 300是一种高性能晶圆步进器,旨在支持光刻应用的所有成像要求。凭借其最先进的设计,Saturn Spectrum 300晶圆步进器在整个晶圆上提供精确的对准、可重现的曝光和可重复的成像。步进器具有先进的光学设备,具有宽视场(FOV),可确保晶圆表面的最大分辨率。FOV可以延伸到300毫米,达到的总聚焦深度(DOF)小于2.5微米。系统中使用的数字化高速CCD摄像头和复杂的模式识别算法确保了高精度对准和精确曝光。ULTRATECH Saturn Spectrum 300的可调基板提供精细的运动分辨率和晶圆的精确对准。基板最多可调整四个区域的截面登记,允许暴露于不规则系统。步进器的运动轮廓可以调整,以优化吞吐量,减少循环时间。Saturn Spectrum 300具有一系列高级成像工具,包括复杂的掩模模式识别功能、负图像条变换工具和高级自动对焦单元。高级掩码模式识别功能在印记过程中识别并定位对象。负图像条变换工具支持在印迹过程中阵列方向的变化。先进的自动对焦机确保在成像时进行适当的对焦调整。此外,ULTRATECH Saturn Spectrum 300设有3轴机动级,提供九个自由度,以提供卓越的运动精度。3轴电动级利用各种步骤支持给定结构内的模式匹配,而两次曝光之间的集成旋转式快门产生极为均匀的曝光场。这种晶圆步进器与推荐的辐射源如ArF激光器和I-line兼容,用于精确印迹。Saturn Spectrum 300 wafer stepper内置了辐射剂量测量的安全功能,以保护用户免受暴露。总体而言,ULTRATECH Saturn Spectrum 300是一种用途广泛且精确的晶圆步进器,在光刻应用中提供卓越的分辨率、重复性和准确性
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