用過的 CINCINNATI 2 (WAFER GRINDING, LAPPING & POLISHING) 出售

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2 結果發現: 用過的 WAFER GRINDING, LAPPING & POLISHING, CINCINNATI 2

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  • Photo CINCINNATI 2

    CINCINNATI: 2 #134544

    WAFER GRINDING, LAPPING & POLISHING Tool and cutter grinder Area of table: 36"x5.25" Swing over table: 10" Length between workhead and c...
  • Photo CINCINNATI 2

    CINCINNATI: 2 #134548

    WAFER GRINDING, LAPPING & POLISHING Tool and cutter grinder Area of table: 36"x5.25" Swing over table: 10" Maximum center distance: 27" ...
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