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790
Reactive Ion Etcher (RIE), 2"-6" Single chamber Material used: Gas and Silicon MFC: N2/SiH4/HE, HE,
105
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Reactive Ion Etcher (RIE), 6", parts system PFEIFFER / BALZERS TPH240 Turbo vacuum pump with TCP 380
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PECVD System Operating system: Windows 3.1 RF Plasma ADVANCED ENERGY RF 5S Power supply Power outpu
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PECVD Deposition system, 2"-6" PC OS controlled 8" Electrode Advanced Energy RFPP - RF5S power supp
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PECVD Deposition system, 8" Upper & lower electrode Advanced Energy RFSS 5S Lower electrode heated
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PECVD System, 8" RIE Dual chamber Manual load Non-load lock RFPP RF5S RF Power supply with matching
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PECVD Deposition system, 2-8" PC OS controlled 11" Electrode Advanced Energy RFPP - RF5S power supp
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Reactive Ion Etcher (RIE), 8" Windows: PC Controlled with flat panel display Lower electrode, 11" M
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