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Reactive Ion Etcher (RIE), 2"-6" Single chamber Material used: Gas and Silicon MFC: N2/SiH4/HE, HE,
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PECVD Deposition system, 2"-6" PC OS controlled 8" Electrode Advanced Energy RFPP - RF5S power supp
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PECVD System, 8" RIE Dual chamber Manual load Non-load lock RFPP RF5S RF Power supply with matching
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