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AMAT / APPLIED MATERIALS
P5000
PECVD System, 8" Nitride PARC (4) CVD Chambers Wafer sense Robot Storage elevator Ergo cassette load
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PECVD SiO2 / SiN /dry etcher, 6" Mark II frame Chambers and gas configuration: Dry etch, TEOX, SIN
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PECVD System, 6" Mark II frame Chamber and gas configuration: (3) PETEOS Etch (4) TEOS chamber and
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System Chamber position: A, B, D Downstream Plasma Apparatus (DPA) Slit valve type: S Slit Slit valv
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TEOS System, 6" With heat exchanger (3) CVD Chambers Etch back chamber (2) DxL Chambers (2) Etch Cha
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PECVD System, 8" Process: Passivation Chamber type: DLH CIM Linked Main frame Load lock SMIF System
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Wet etcher, 8" (3) Chambers Gas: SF6, CL2, Ar, He 1994 vintage.
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